Radio-Based Interconnects Promise Faster, Leaner AI Infrastructure
A new generation of startups is exploring terahertz and millimeter-wave radio technology as an alternative to traditional copper and optical connections for server-to-server communication in AI data centers. According to a report by IEEE Spectrum, companies like Point2 and AttoTude believe radio-based interconnections can deliver ultra-high bandwidth with lower power consumption and reduced physical footprint.
Scale-Up Connectivity Becomes a Bottleneck
As rack-scale AI systems grow more powerful, scale-up connectivity—high-bandwidth, low-latency links between servers—has become increasingly difficult to achieve using copper cables. Optical connections offer a solution, but they are often costly and over-engineered for short-range interconnects within data center racks.
Point2’s “Active Radio Cable” Delivers 1.6 Tb/s
Point2’s solution centers on what it calls an “active radio cable,” built from eight proprietary e-Tube waveguides. Each waveguide carries data using two frequencies—90 GHz and 225 GHz—with plug-in modules at both ends converting digital signals directly into modulated radio waves.
A single cable delivers 1.6 terabits per second, occupies just 8.1 millimeters—about half the volume of comparable active copper cables—and supports distances of up to seven meters, making it well-suited for rack-scale systems.
also like to read Zong and Huawei Achieve Pakistan’s First Full-Duplex E-Band Microwave Link Test
Lower Power, Slightly Higher Cost Than Optical
Point2 claims its design uses one-third the power of optical links, adds negligible latency, and delivers significantly higher efficiency. However, the system currently costs about one-third more than optical solutions, positioning it as a performance-focused alternative rather than a low-cost replacement.
Also like to read How to Enable Private DNS on Android for Better Privacy and Security
Manufacturing Ready for Scale
A key advantage of the approach is its maturity. The radio transceivers can be manufactured using standard semiconductor processes, with successful demonstrations already completed on a 28nm chip in collaboration with KAIST. Cable manufacturing partners Molex and Foxconn Interconnect Technology have also confirmed production can scale using existing facilities.
0 Comments